SMO / Non-RT RIC
Service management, orchestration, data exposure and policies. rApps run in this environment.
Network functions, software, equipment, interfaces and validation evidence for an interoperable radio access network.
Open RAN separates management, control, central/distributed processing and radio functions. Multi-vendor interoperability requires compatible profiles, releases and measured integration tests.
Service management, orchestration, data exposure and policies. rApps run in this environment.
Runs xApps, receives A1 guidance and communicates with E2 nodes.
Central, distributed and radio units backed by O-Cloud compute, transport, synchronization and power.
| Interface | Endpoints | Key checks |
|---|---|---|
| Open Fronthaul | O-DU ↔ O-RU | 7-2x profile; C/U/S/M planes, optical rate, timing and transport |
| E2 | Near-RT RIC ↔ E2 node | E2AP and supported E2 service models, telemetry and control |
| A1 | Non-RT RIC ↔ Near-RT RIC | Policy and enrichment information |
| R1 | rApp ↔ Non-RT RIC / SMO | Service access, data exposure and lifecycle |
| O1 / O2 | SMO ↔ RAN / O-Cloud | Management and cloud infrastructure |
| F1 / E1 | O-CU ↔ O-DU / CU-CP ↔ CU-UP | 3GPP split processing |
Version-specific requirements: O-RAN ALLIANCE specifications.
The list describes candidate applications. It does not claim these are released or deployed Tancell products.
Inputs and actions depend on the E2 service models implemented in the target RAN.
Open-source use caseInputs include historical KPIs, topology, inventory and approved SMO/R1 services.
R1 specificationsSelection checklist with linked manufacturer product photographs and specifications. Linked products are examples from their makers, not Tancell-branded inventory. Confirm exact bands, power, ports, environmental ratings and approvals from the selected model's current datasheet.
Check FR1 band, bandwidth, TDD/FDD, RF power, MIMO, fronthaul profile/optics, timing, DC input, IP rating and temperature.
Models and photographsExample Supermicro SYS-112B-FWT: 1U, single Xeon 6, up to 1 TB DDR5 ECC, 2 × 10GbE RJ45, redundant 800 W supplies. DU software may need separate fronthaul NIC, timing and acceleration.
Official specificationsSize CPU, RAM, storage, container orchestration, E2/A1/R1 adapters, observability, security and HA to target network scale.
O-RAN SC componentsFiber and optics, switching, PTP/SyncE/GNSS, boundary clock, rectifier, surge protection, outdoor enclosure and grounding. Dimension against chosen RU/DU profile.
Fronthaul specificationsTM500 O-DU Tester supports direct O-DU fronthaul testing and multiple profiles. Confirm licenses, release support and calibration.
Product and resourcesCore emulator, UE simulator, channel emulator, spectrum analyzer, RF meter, packet capture and synchronization measurement.
O-RU tester exampleThe Tancell FAT/SAT PDF is a commissioning template with sample/simulated values. There is no verified Tancell Open RAN certification or measured product test report in the materials provided.
| Test family | Checks | Required record |
|---|---|---|
| Conformance | Open Fronthaul planes and relevant E2/A1/O1/O2 profiles | DUT IDs, version, procedure, traces and pass/fail |
| Interoperability | Cross-vendor RU/DU/CU/RIC and apps | Compatibility matrix, defects and retest |
| RF and performance | EVM, ACLR, power, throughput, latency, mobility | Calibrated plots, limits and conditions |
| Timing and transport | PTP/SyncE, holdover, loss and delay | Clock chain and measured margins |
| Security / resilience | Authentication, failover, rollback | Security and recovery logs |
| FAT / SAT / E2E | Factory, site and full network acceptance | Dated, signed measurements |
Illustrative values must be replaced with witnessed measurements before certification or contractual acceptance.
Open template PDFOTICs issue certificates and badges after applicable conformance, interoperability or end-to-end testing. Report summaries are held by the issuing OTIC.
Certification programTesting guidanceReferences: O-RAN specifications · OTIC · O-RAN SC. Product photographs and trademarks belong to their respective manufacturers.